Lifecycle Status  

ACTIVE (Last Updated: 6 days ago)

Factory Lead Time  

12 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

6-WDFN Exposed Pad

Number of Pins  

6

Transistor Element Material  

SILICON

Number of Elements  

2

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e3

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

6

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

AVALANCHE RATED

Max Power Dissipation  

2.3W

Terminal Form  

NO LEAD

Base Part Number  

CSD87502

Element Configuration  

Dual

Operating Mode  

ENHANCEMENT MODE

Case Connection  

DRAIN

FET Type  

2 N-Channel (Dual)

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

32.4m Ω @ 4A, 10V

Vgs(th) (Max) @ Id  

2V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

353pF @ 15V

Gate Charge (Qg) (Max) @ Vgs  

6nC @ 10V

Drain to Source Voltage (Vdss)  

30V

Continuous Drain Current (ID)  

5A

Drain Current-Max (Abs) (ID)  

5A

Pulsed Drain Current-Max (IDM)  

23A

DS Breakdown Voltage-Min  

30V

Avalanche Energy Rating (Eas)  

3.1 mJ

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Standard

Feedback Cap-Max (Crss)  

29 pF

Length  

2mm

Width  

2mm

Thickness  

750μm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free